OIF Members to Showcase Multivendor Interoperability for Critical Network Technologies at ECOC 2022

A record number of companies will demonstrate interoperability in the 400ZR; Co-packaging architectures, IEC-112G & IEC-224G and CMIS implementations

FREMONT, Calif., September 07, 2022–(BUSINESS WIRE)–OIF will host the world’s largest interoperability showcase at the OIF booth, #701, during ECOC 2022, September 19-21, Basel, Swiss. Nearly 30 member companies participate in demonstrations in four critical areas: 400ZR optics, co-packaging architectures, common electrical I/O (CEI) architectures, and common management interface specification (CMIS) implementations.

OIF experts will also participate in the Market Focus program at ECOC, discussing its work in CMIS in one session, which defines current and future generations of management control for optical and copper modules, and a second session addressing of the successful development of the 400ZR optic, and OIF work to define 800ZR/LR.

“The high level of participation in this year’s interoperability demonstration at ECOC demonstrates the global significance of OIF’s work and the collective efforts of its members to show how their solutions establish an ecosystem and work together to foster implementation of next-generation capabilities,” said Mike Klempa, Alphawave IP Group and chair of the OIF Physical & Link Layer Interoperability Working Group.

The demonstration of interoperable optical networking solutions – live and static – at ECOC will feature 28 OIF member companies – a record number of attendees: Alphawave IP; amphenol; Applied Optoelectronics Inc.; cadence design systems; Ciena; Cisco; Corning; Creed; EXFO; Fujitsu optical components; Juniper Networks, Inc.; Keysight Technologies; Lumentum; marvel; MaxLinear, Inc.; Microchip Technology Incorporated; Molex; MultiLane, Inc.; Nokia; O-Net communications; Senko Inc. Advanced Components; Sumitomo Electric Industries, Ltd. ; Synopsys, Inc.; TE connectivity; US Conec; VIAVI Solutions Inc.; Wilder Technologies and Yamaichi Electronics.

Demo 400ZR

OIF’s 400ZR project is proving effective in facilitating new, simplified architectures for high-bandwidth inter-data center interconnects and promoting interoperability among coherent optical module manufacturers. This 400ZR interoperability demonstration shows a full implementation in an 80km DWDM ecosystem using multiple form factor pluggable modules, 400GbE routers, 75GHz C-band open line system and test equipment solutions from multiple suppliers. The demonstration provides evidence of readiness for large-scale deployment of the 400ZR based on a large ecosystem of interoperable solutions.

Co-packing demonstration

As individual companies consider options to optimize power and density, OIF has seen the need to lead industry standardization discussions for co-packaging architectures that promise to reduce power consumption. and increase bandwidth density. OIF is leading industry interoperability discussions for co-packing solutions and will showcase its progress with multi-stakeholder demonstrations of its 3.2T Module Project and External Laser Small Form Factor Pluggable (ELSFP) Project . A variety of interoperable components that enable co-packaging will be presented, along with an implementation of the system.

Common Electrical I/O Demo (IEC)

OIF has played a leading role in moving the industry to the next generation by developing electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations showcasing the interoperability between the 14 participating members prove the critical role OIF plays as well as the developing vendor ecosystem. IEC-112G demonstrations at the OIF booth will showcase multiparty silicon vendor interoperability across various channels, including mated compliance boards, PCB channels, direct-attach copper cable channels, background wired basket and even fiber. Each configuration demonstrates the technical viability of 112 Gbps operation, as well as several industrial form factors including OSFP and QSFP-DD. The demo also shows a distant eye diagram measured on an oscilloscope with analysis to show an example of the silicon signal integrity that is typically required to traverse the wide variety of channels displayed.

As the industry eagerly awaits higher data rates and increased throughput for the next generation of 224 Gbps-per-lane based systems, new specifications and technologies will be required. The OIF, where the optical networking industry’s interoperability work is done, is leading the charge on 224G hardware interconnect application spaces and definitions, publicly unveiling the first live 224G demo at ECOC.

Demonstration of Common Management Interface Specification (CMIS) implementations

CMIS is now established as the management interface of choice for next-generation pluggable modules, capable of handling both simple and advanced modules. CMIS provides a well-defined common mechanism to initialize and manage optical and copper modules while providing the ability to support custom functionality. This commonality facilitates integration into different host platforms for both the host vendor and the module vendor. The CMIS demo consists of four separate demos that show how modules can be managed and initialized, how modules can support multiple independent services (breakout), and how module firmware can be easily upgraded.

OIF @ ECOC 2022 Market Focus

TUESDAY September 20 – 4:10:00 p.m. – 4:30:00 p.m. (4:10 p.m. – 4:30 p.m.)

CMIS – Optical Modules Management Control

Speaker: Gary NichollCisco, OIF Physical & Link Layer Working Group Management Co-Vice President, Secretary/Treasurer and Board Member

CMIS addresses the need for industry commonality in pluggable module management, and it has been widely and successfully adopted throughout the industry. As the complexity of pluggable modules continues to increase and the industry continues its trend toward third-party pluggable modules, the management interface is becoming as important an interoperability interface as the electrical and optical interfaces (where OIF is actively involved for many years). This session will provide a high-level overview of CMIS, explain why the effort has moved to OIF, discuss the current state of CMIS within OIF, and highlight some of the new features of the CMIS that OIF will be working on in the coming year, such as adding support for co-packaging/External Laser Small Form Factor Pluggable (ELSFP) projects and electrical bonding training.

WEDNESDAY September 21 – 12:00:00 – 12:25:00 (12:00 – 12:25)

Deployment of the 400ZR and ongoing OIF work to define the 800ZR/LR

Speaker: Karl GassOptical Vice President of the OIF Physical Layer and Link Layer Working Group

The consistent deployment of the 400ZR is underway and shows that a strong ecosystem already exists for this new interoperable standard developed by the OIF. In this presentation, an OIF expert will provide an overview of the 400ZR and discuss the status of its deployment, including ongoing optimization. The presentation will then provide an overview of the current technical work of the 800ZR and 800LR to create the next core network architecture components and bring consistent networking into the data center.

About the OIF

The OIF is where the interoperability work of the optical networking industry takes place. Building on nearly 25 years of forward evolution in the industry, OIF represents the dynamic ecosystem of more than 130 leading network operators, system vendors, component vendors and test equipment vendors. plan that collaborate to develop interoperable electrical, optical and control solutions that have a direct impact on the industry. ecosystem and facilitate global connectivity in the open network world. Connect with the OIF on @OIForumon LinkedIn and at http://www.oiforum.com.

See the source version on businesswire.com: https://www.businesswire.com/news/home/20220907005540/en/


Leah Wilkinson
Wilkinson + Associates for OIF
[email protected]